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Teh, W.H.; Caramto, R.; Arkalgud, S.; Saito, T.; Maruyama, K.; Maekawa, K. . (2009). [IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - Magnetically-enhanced capacitively-coupled plasma etching for 300 mm wafer-scale fabrication of Cu through-silicon-vias for 3D logic integration. , (), 53–55. doi:10.1109/iitc.2009.5090338 
10.1109/iitc.2009.5090338