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Beyne, Eric; Kim, Soon-Wook; Peng, Lan; Heylen, Nancy; De Messemaeker, Joke; Okudur, Oguzhan Orkut; Phommahaxay, Alain; Kim, Tae-Gon; Stucchi, Michele; Velenis, Dimitrios; Miller, Andy; Beyer, Gerald . (2017). [IEEE 2017 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2017.12.2-2017.12.6)] 2017 IEEE International Electron Devices Meeting (IEDM) - Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology. , (), 32.4.1–32.4.4. doi:10.1109/IEDM.2017.8268486 
10.1109/IEDM.2017.8268486